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#: 3M; 3M Interconnect Solutions
C: C&K Components; Caddock Electronics Inc; Cardinal Components Inc.; CEL; Cinch Connectors; Citizen Finetech Miyota; Clare; Coherent Auburn Group - Instrument Division; Coiltronics/Div of Cooper/Bussmann; Comair Rotron; Conec; ConnectBlue; Connor-Winfield; Switchcraft; Copal Electronics Inc; Coto Technology; Cramer Co.; Cree Inc; Crydom Co.; CSR PLC; C-TON Industries; CTS Electrocomponents; CTS Resistor Products; CTS Thermal Management Products; CUI Inc; CW Industries; Cymbet Corporation; Cantherm; Capital Advanced Technologies; Carling Technologies; CBM America Corporation; Cherry; Chicago International Industries/Brand 77 Tools; CHICAGO MINIATURE LIGHTING, LLC; Chip Quik Inc; Cirrus Logic Inc; C-Max; Cogent Computer Systems; Comchip Technology; Cooper/Bussmann; Copeland Communications Inc; Cornell Dubilier Electronics (CDE); CR Magnetics Inc; Crouzet C/O BEI Systems and Sensor Company; Crouzet USA; Crystek Corporation; CTS-Frequency Controls; Curtis Industries; Curtis Instruments Inc; Custom Computer Services Inc (CCS); Cynergy 3; Cypress Semiconductor Corp; Cooper Bussmann; Cortina Systems; Cree Asia-Pacific Ltd.; Critical Link; CapXon; CAO Group, Inc; Cavium Networks; Chenbro Micom Usa, Inc.; Cirrus Logic; Citizen Componenti; Colibrys; Conesys; CONNECT ONE; CTS Components; Cypress Semiconductor; Coilcraft; C2; COSEL USA
F: Fairchild Optoelectronics Group; Fairchild Semiconductor; FCI; FDK America Inc; Finisar Corporation; Fotofa; Free2Move; FEIG Electronic; Flambeau Inc; Flexipanel; Fox Electronics; Freescale Semiconductor; FTDI; Fujitsu Semiconductor America Inc; Future Designs Inc; Fairchild Semiconductor Inc.; FCI SA; Finisar; Fox; Freescale; Fujitsu; FUJISOKU; Filotex; Fair-Rite
I: IAR Systems Software Inc; ICC/Elpac Power Syst; IDT; Imagecraft Creations Inc; Industrial Fiberoptics; ITT Cannon; Injectorall Electronics; ISSI, Integrated Silicon Solution Inc; I.O. Interconnect; Infineon Technologies; Intel; Interlink Electronics; International Rectifie; Intersil; IRTOUCH SYSTEMS; ITW Chemtronics; IAR Systems; IBase Technology (USA) Inc.; IBM Microelectronics; Ingram Micro-Western Digital; Integrated Device Technology (Idt); Integrated Electronics Solut; Integrated Silicon Solutions; Intel Digital Health Group; In-Win Development; Itox, Inc.; ITT Industries, Cannon Switch / C&K; ITT Interconnect Solutions; iC-Haus; IC Plus Corp; IMP; INFINEON/FAIRCHILD; IR; IXYS
Q: Qimonda; Qualtek; Quarton Inc; Quadravox Inc; Quatech/DPAC Technologies; Quickfilter Technologies LLC; Quadrangle; QuartzCom
O: OKI/Metcal; OmniVision Technologies Inc; Omron Electronics Inc-ECB Div; Omron Electronics Inc-IA Div; ON Semiconductor; Onset Computer Corp; OSRAM Opto Semiconductors Inc; Ohmite; OK Industries/Div of Jonard Ind Corp; On Shore Technology Inc; Opto Diode Corp; Optrex America Inc; OCZ; Oki Semiconducto; Omron Electronics; On Semiconducto; Opnext; Optrex; Osram Opto Semiconductor; Omron
X: Xeltek; Xilinx Inc; Xilinx
U: Unigen Corp; United Chemi-Con; US-Lasers Inc; US Relays and Technology, Inc.; US Senso; Unknow; Universal Scan; UPEK; UTC; U-BLOX
S: Samtec Inc; SanDisk; Sanyo Energy; Schott Corporation; Semtech; Sensata Technologies/Airpax; Sensory Inc; Seoul Semiconductor Inc; Sequia Publishing Co.; Sharp Microelectronics; Sigma Designs Inc; Signal Transformers; Singatron Enterprises Co Ltd; Skyetek Inc; SL Power Electronics Manufacture of Condor/Ault Brands; SMC Corporation of America; Soberton Inc; SofTec Microsystems SRL; Souriau Connection Technology; Spectra Symbol; Stack Electronics; Staco Energy Products Company; Steinel America; Stewart Connecto; Storm Interface; Switchcraft Inc.; Synapse; SUMIDA AMERICA COMPONENTS INC; Sagrad Inc; SANYO; Schaffner EMC Inc; Schurter Inc; Segger Microcontroller Systems; Serpac; Signum Systems Corp; Silicon Laboratories Inc; Skyworks Solutions Inc; SMSC; Sprague-Goodman; SSI Technologies Inc; Stackpole Electronics Inc; Stanley Electric Co; ST-Ericsson Inc; STMicroelectronics; Sullins Connector Solutions; Sunon Fans; Susumu; Swanstrom Tools USA; Samsung; Samtec; Schurte; Seagate Technology; Seiko Instruments; Seoul Semiconducto; Silicon Laboratories; SIMCOM LIMITED; Skyworks; SL Power Electronics; Sliger Designs, Inc.!; Smart Modular Technologies; Sola / Hevi-Duty; Sony; Sony Nec Optiarc America; Sp Devices, Inc.; Spansion; SPARKLE POWER INC.; Spectrah Dynamics; SST; ST Ericsson; Standard Microsystem (Smsc); STEC; Steward; Sumida; Sunon; SUPER MICRO COMPUTER, INC.; Supertex Inc.; SynQo; Systium Technologies; SyncMOS; STC; Sealand; Shindengen; Shanghai Sunrise Electronics

A: Aavid Thermalloy; Abracon Corporation; Advanced Photonix Inc; Advanced Thermal Solutions Inc; AKM Semiconductor Inc; AlfaMag Electronics, LLC; All Sensors Corporation; Ametherm; Amphenol Commercial Products; Amphenol Connex; Amphenol PCD; Amphenol-Tuchel Electronics; Antenova; Apex Tool Group; API Delevan Inc; APM Hexseal; Aptina LLC; Atmel; austriamicrosystems; Avago Technologies US Inc.; Assmann Electronics Inc; Astro Tool Corp; Aven Tools; AVX Corporation; ACL Staticide Inc; Acme Electric/Amveco/Actown; Advanced Linear Devices Inc; Alcatel Components; Allegro Microsystems Inc; Alpha & Omega Semiconductor Inc; Alpha Wire Company; Altera; American Electrical Inc; Amphenol Industrial Operations; Amphenol Sine Systems Corp; Amphenol-RF Division; Amprobe; Amulet Technologies LLC; APEM Components; ARI International Corporation; Aries Electronics; Artaflex Inc; Analog Devices Inc; Actel; Aaeon Electronics Inc; ABRACON; Adaptec, Inc.; ADI Engineering; Adlink; Advanced Ceramic X Corp.; Advanced Industrial Compute; Advanced Micro Devices; Advanced Micro Devices-Latin; Advantech; AEM Inc; Aep (Applied Engineering Products); Agilent Technologies; Airpax; Allegro; Alps Electric; AMCC; American Industrial Systems; American Power Conversion; Amphenol; Amphenol Alden; Amphenol Nexus; Amphenol TCS; Analog Devices; Anaren Microwave; API Delevan; ARTEL SOFTWARE INC.; Artesyn; Astec Powe; Asus Compute; AU Optronics Corp; Avago Technologies; Avnet Electronics Marketing; AVX; AVX / Elco; Axiomtek; AZ Displays, Inc.; ALLIANCE MEMORY INC; ALPHA SEMICONDUCTOR; AMD
D: DeLorme; Delta Product Groups; Desco; Digi International; Diodes/Zetex; DLP Design Inc; Daburn Electronics; Datak; Delphi Connection Systems/Specialty Electronics; Deus Ex Machina Engineering; Dialight; Digi International/Maxstream; Digi-Key Corp.; Digi-Key Evaluation Boards; Digi-Key/Cree; Digital View Inc; Diodes Inc; Delkin Devices; Diamond Flowe; Digital View; Diodes, Inc / Zetex; DBRS; DDC; DEI; Davicom
G: Gems Sensors Inc; GC Electronics; GE Sensing; General Cable/Carol Brand; Grayhill Inc; Glenai; Grayhill; Gsi Technology; Gunze USA; Greenliant; GENNUM; GCT
J: JAE Electronics; Jaro Components Inc; JKL Components Corp.; Johanson Dielectrics Inc; Judco Manufacturing Inc; JW Miller A Bourns Company; JST Sales America Inc; Jelight Company; Jewell Instruments LLC; Johanson Technology Inc; Jetway; Johanson Technology; JRC
M: Mallory Sonalert Products Inc; Master Appliance Co; Maxim Integrated Products; Measurement Specialties Inc.; Measurement Specialties Inc/MEAS France; Memcor-Truohm; MG Chemicals; Micro Commercial Co; Microchip Technology; Micron Technology Inc; Micronas; Microsemi Analog Mixed Signal Group; Microsemi Power Products Group; Mide Technology Corporation; Modern Technology; Molex Inc; Mueller Electric Co; Magnasphere Corp; Martel Electronics; Matrix Orbital; Measurement Specialties Inc/Schaevitz; MEC Switches; MEDER electronic; Melexis Inc; MeshNetics; Micrel Inc; Micro Oscillator Inc; Microsemi Power Management Group; Mill-Max Manufacturing Corp.; Modular Cable Assemblies (VA); Molex Connector Corporation; MicroEngineering Labs Inc; Microsemi Commercial Components Group; MPD (Memory Protection Devices); Multi-Tech Systems; Multi-Tech Systems Inc; Murata Electronics North America; Murata Power Solutions Inc; Mitsubishi; M/A-Com Technology Solutions; MAGNUM (COOPER); Marvell; MEMSIC INC; Microchip; Micron; Microsemi; Micro-Star International; Microtips Technology, Llc; Mindspeed Technologies; MMD COMPONENTS; Molex; Monolithic Power Systems; MontaVista; Moschip Semiconductor, Usa; Murata Electronics; Murata Power Solutions; MITSUMIS/MITSUBISHI; MACRONIX; Magnetic
H: Hammond Manufacturing; Hoei America Inc; Holtek; Honeywell Microelectronics & Precision Sensors; Horn Industrial Co LTD; Hamlin Electronics Limited Partnership; Harwin Inc; Hirose Electric Co Ltd; Honeywell Sensing and Control; Honeywell Sensing and Control/Clarostat; Honeywell Sensing and Control/Hobbs; Huntington Electric Inc.; HANTOUCH USA; Hitachi Global Storage Tech; House of Batteries; HALO ELECTRONICS; Hynix Semiconductor; Holt Integrated Circuits; Hittite; Hypertronics
R: Radial Magnet Inc; Radios Inc; Renesas Electronics America/NEC; Richco Plastic Co; Rohm Semiconductor; Roman-Jones Inc; Riedon; Ripley Tool/Mille; Rose+Bopla Enclosures; Recom Power Inc; Red Lion Controls; RFM; Rabbit Semiconductor; Renesas Electronics; RF Solutions; Roving Networks Inc; Realtek; Radiall; Renesas; Rohm; RAMTRON; RICHTEK USA INC
V: Vector Electronics; Vishay Precision Group; Vishay/Electro-Films; Vishay/General Semiconductor; Vishay/Sfernice; Vishay/Vitramon; Volgen America/Kaga Electronics USA; Varitronix; Vishay/BC Components; Vishay/Beyschlag; Vishay/Dale; Vishay/Phoenix Passive Components; Vishay/Semiconductors; Vishay/Siliconix; Vishay/Spectrol; Vishay/Sprague; Vishay/Thin Film; Vitesse Semiconductor Corp; VTI Technologies; Via Technologies, Inc; Vicor; Vishay / Bc Components; Vishay / Dale; Vishay / Roederstein; Vishay / Semiconductor; Vishay / Siliconix; Vishay / Sprague; Vishay / Vitramon; VLSI
Y: Young Optics; Yageo

B: B B Battery; B&F Fastener Supply; Bergquist; Bivar Inc; B&K Precision; Bluetechnix; BNS Solutions; Bosch Sensortec; Bourns Inc.; Bridgelux; Bulgin; Bel Fuse Inc; Bud Industries; Bomar Interconnect Products Inc; Bcm Advanced Research; Bel; Belkin Logistics Inc.; Bourns; Bourns / J.W. Mille; Broadcom; balluff; BENCENT
E: Energizer Battery Company; EnerSys; Enfis; EPC; E2V; EDAC Inc; Electroswitch; Emerson Network Power/Embedded Powe; Epson Electronics; E-Switch; Eastman Kodak Company; Easy Braid Co.; EBM-Papst Industries Inc; ECS Inc; EDP Company; Elna America; Embedded Artists; Emerson Network Power Connectivity Solutions; Energy Micro; Enhanced Video Devices Inc; Epson Toyocom Corporation; E-T-A; Ethertronics Inc; EPCOS Inc; Equinox Technologies; EverSpin Technologies Inc; Exar Corporation; Excelsys Technologies Ltd; E-Z-Hook; Ebm-Papst; Elo Touchsystems; Ember Corporation; Emerson Network Powe; Endicott Research Group; Enhance Technology; Epcos (Siemens); Ericsson Power Modules; EuroTech; Everlight Electronics; EPCOS
P: Panasonic - BSG; Panasonic - ECG; Panasonic - SSG; Panduit Corp; Parlex Corp; Patco Electronics; Phoenix Contact; Pomona Electronics; Pontiac Coil Inc; Power-One; PRD Plastics; Precision Electronic Components Ltd; Pulse Electronics; Paladin Tools; Panasonic - ATG; Panasonic - Consumer Division; Panasonic - Consumer Electronics Corp.; Panasonic - DTG; Panasonic Electric Works; Panavise; Parallax Inc; Patco Services Inc; Pericom; PHIHONG USA; Phyton Inc; Portescap; Power Integrations; Powerex Inc; PUI Audio, Inc.; Pulsa; Panasonic; Panduit; Panjit; Pericom Semiconducto; PHYTEC; PLDA; PLX Technology; PMC Sierra; PNY Technologies Inc.; Portwell; Powerfilm Inc.; Powertip Technology; Prolific Technology Inc.; Promise Technologies; PUI Audio; Pulse; Philips; P-DUKE
K: Kaltman Creations LLC; Keil; Kester Solde; Kingbright Corp; Knowles Acoustics; KSM Electronics Inc.; Kemet; Keystone Electronics; Kilo International; Kingston Technology; Kontron; Kyocera; KEC; KYCON
N: Nichicon; Nearson Inc; NEC; Newava Technology Inc; Newhaven Display Intl; Nakagawa Manufacturing; NMB Technologies Corporation; Norcomp Inc.; Numonyx/Intel; Numonyx/Intel [CI]; Nuvoton Technology; NXP Semiconductors; National Semiconductor; Navman Wireless; NDK; Needhams Electronics; NessCap Co Ltd; NetBurner Inc; NJR; NKK Switches; Noritake Company Inc; Numonyx/ST Micro; NVE Corp/Isolation Products; NVE Corp/Sensor Products; Nidec Copal Electronics; NMB Technologies; NORDIC VLSI ASA; Numonyx; NSC; Navman; NEC Electronics; NEX Computers; NIC Components; Nuventix
L: Laird Thermal Products; LEDdynamics Inc; LIGHTING SCIENCE GROUP CORPORATION; Littelfuse / Teccor Brand Thyristors; Littelfuse / Wickmann Brand; Littelfuse Inc; Logic; Lumex Opto/Components Inc; Luxo; Laird Technologies EMI; Laird Technologies Wireless M2M; Laird-Signal Integrity Products; Ledil; LEM USA Inc; Lineage Powe; Linear Technology; Lite-On Inc; Littelfuse / Teccor Sidactor(R) Product; LMB Heeger Inc.; Logical Systems Inc.; Lattice; Lattice Semiconducto; Leach International; Legacy Electronics, Inc.; Lemo Usa, Inc.; Leopard Imaging; LG.Philips Lcd; Lite-On; Luminus Devices
T: Taiyo Yuden; TDK Corporation; TechTools; Techwell LLC; Tensility International Corp; Texas Instruments; TLG Publications; Tripp Lite; TT Electronics/BI; Tusonix a Subsidiary of CTS Electronic Components; TXC CORPORATION; Tadiran Batteries; Tamura; Taoglas Limited; TDK-LAMBDA AMERICAS INC; Terasic Technologies Inc; Toko America Inc; Torex Semiconductor Ltd; Toshiba; TPI (Test Products Int); Triad Magnetics; TT Electronics/Optek Technology; Twin Industries; Tyco Electronics; Triquint; TDK Corp.; TDK-Lambda Americas Inc.; TEAC; Teledyne Relays; Thinking Electronic Co.,Ltd; Tianma Microelectronics; TOKO America; Toshiba Flat Panel/Mass Storage; Touchstone Technology Inc.; Transcom; TranSwitch; Triquint Semiconductor; Tri-Star Electronics; Tusonix; Tyan Computer Corp; Tyco Electronics / Alcoswitch; Tyco Electronics / AMP; Tyco Electronics / Augat; Tyco Electronics / Buchanan-Rdi; Tyco Electronics / CII; Tyco Electronics / Coev; Tyco Electronics / Corcom; Tyco Electronics / Madison Cable; Tyco Electronics / P&B; Tyco Electronics / Raychem Circuit Protection; Tyco Electronics / Raychem Wire; Tyco Electronics Corp.; TE Connectivity; TECHFLEX; Takachi Electric Industrial; TUNDRA
W: Wiha; Winbond Electronics; Wurth Electronics Inc; Wakefield Thermal Solutions; Weidmulle; Wintec Industries; World Magnetics; Western Digital Corp; White Electronic Designs; Wi2Wi; WIZnet
Z: Zilog; Zarlink

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